產(chǎn)品詳情
產(chǎn)品描述：
對環(huán)境污染的控制已成為經(jīng)濟發(fā)展中的首要義題，錫鉛焊料是一種高度有毒的金屬合金，它作為組裝輔料被廣泛用于現(xiàn)代電子組裝工業(yè)。隨著歐美RoHS指令的實施，電子產(chǎn)品制造商已經(jīng)趨向于焊料的無鉛化。
The control of environmental pollution has been considered as top priorities in economy development.Tin-lead solder is a highly poisomous bl alloy to used widely in modern modern assemble industry as assemable material .As EU RoHS directive adaptep and the electronic manufactuer has move to ward to lead-free process.
由博億萊公司研發(fā)的BYL-505系列焊錫膏為客戶提供優(yōu)良的可焊性與印刷型。BYL-505系列焊錫膏解決了無鉛焊料在應用中出現(xiàn)的各種問題，如：儲存于 運輸穩(wěn)定性，潤濕性差以及由高溫焊料導致的錫膏不耐熱性。
BYL220 series solder paste was developed by TongFang company,which provide excellent and printbility to meet customer’s needs.The BYL220 series solves various prob lems as the implementation of lead-free solder.suceh asstorage stability,delivery stality,poorsolder wettability,and poor solder paste heat resistance caused by the high temperature solder.
產(chǎn)品特性：
該產(chǎn)品是殘留物無色透明，活性適中，BGA空洞率低，手動印刷不費力，主要用于中高端產(chǎn)品，如DVD，機頂盒等
產(chǎn)品規(guī)格：Solder Specfications
合金成分Comb of solder alloy
|
組成（質量%）Comb(Mass%) |
||
|
SN |
AG |
CU |
|
余量Balance |
3.0±0.2% |
0.5±0.1% |
焊接合金之物理性質Solder alloy physical properties
|
熔融溫度Melting points(°C) |
||
|
液相線Liquidus |
DSC峰值DSC peak |
固相線Solidus |
|
218.0 |
220.0 |
217.0 |
|
密度（g/cm3） |
拉伸強度（Mpa） |
延伸率（%） |
楊氏模量（Gpa） |
0.2%屈服點（Mpa） |
維氏硬度（Hv） |
|
7.38 |
53.3 |
46 |
41.6 |
39.4 |
17.9 |
錫粉規(guī)格Solder powder specification
|
類型Type |
目數(shù)Mesh |
粒度分布PSD(um) |
|
B4 |
-400/+635 |
20-38 |
技術數(shù)據(jù)：
物理性質Physical properties
|
項目Ctegory |
值/結果Values/Results |
測試方法/說明Methods/Remarks |
|
外觀 |
外觀灰白色，圓滑膏狀，無明顯分層。Shall not have separarated flux,and shall be in smooth paste state |
目視 Visual inspection |
|
金屬含量% |
88.50 |
JIS –Z- 3197 8.1.2 |
|
粘度 |
170±30 pa.s |
JIS-Z-3284 6@ Malcom PCU-205:10 rpm 3 min 25±1°C＜60% RH |
|
粘著性 |
Initial:75.6 gm Takc retention @ 24 hr: 120.2 gm Tack retention @ 72 hr: 96 gm |
JIS- Z- 3284 9 |
|
擴散率% |
＞80% |
JIS-Z-3197-8.3.1.1 |
|
錫球實驗 |
可接受Acceptable |
JIS-Z-3284 11 |
|
坍塌測試 |
所有間距無橋接No bridges all spcings |
JIS-Z-3284 7,8 |
|
印刷壽命 |
＞8小時Hours |
@50%RH,23°C（74°F） |
|
再印刷留置時間 |
30-60分鐘 Minutes |
@50%RH,23°C(74°F) |
化學性質Chemical properties
|
活性級別 |
ROL0 |
IPC J-STD-004 |
|
鹵素含量 ppm |
＞1500ppm |
JIS Z-3197 8.1.4.2.1 |
|
銅鏡腐蝕 |
No removal of copper film 無銅層剝離 |
JIS Z-3197 8.4.2 |
|
銅板腐蝕 Copper Corrosion |
沒有腐蝕發(fā)生，NO Corrosion Occur |
IPC-TM-650 2.6.15 |
電氣性能
|
表面絕緣阻抗 |
Ordinary state 1×1012(Ω)or above After humidifying 1×109(Ω)or above After 100hrs.in humidity |
JIS Z 3284-14 |
|
電遷移 |
Pass,Tess Conditions:65°C，88.5% RH for 596 hrs |
IPC-TM-650,2.6.14.1 |
